Shenzhen Hongfucheng New Material Co., Ltd.Shenzhen Hongfucheng New Material Co., Ltd.
 

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Solving the bottleneck of heat conduction in high-power electronic components

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Solutions

Class

Aerospace, Military, LiDAR

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The liquid metal is added with a heat conduction sheet. The convex structure has a high compressibility of more than 40%, which can greatly reduce the contact thermal resistance. Its performance is far better than that of traditional silicon based gaskets. At present, it is mainly used in immersion servers, aerospace and military industries and other fields.

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Contact

Address:No.7 Fuyong East, Building C, Fenghuang Third Industrial Zone, Bao'an District, Shenzhen

Tel:0755-27327247

E-mail:hfc_zxy@szemi.cn

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