Shenzhen Hongfucheng New Material Co., Ltd.Shenzhen Hongfucheng New Material Co., Ltd.
 

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Solving the bottleneck of heat conduction in high-power electronic components

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Class

Semiconductor related

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Liquid metal thermal conductive film/paste is widely used for filling between high-temperature and high heat flux chips and heat sinks, replacing traditional imported thermal conductive silicone grease, gaskets, etc. It has high thermal conductivity, low thermal resistance, good wettability, environmental protection, and can be reused. The melting point can be adjusted according to different application scenarios.


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Address:No.7 Fuyong East, Building C, Fenghuang Third Industrial Zone, Bao'an District, Shenzhen

Tel:0755-27327247

E-mail:hfc_zxy@szemi.cn

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