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The new generation of interface thermal conductive materials has achieved revolutionary breakthroughs in thermal conductivity power

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LM-I

LM-I-N It is a pure metal thermal conductivity plate that fully fills the interface through deformation. The thermal conductivity plate will have good contact with the interface and reduce contact thermal resistance. It is designed specifically for high heat flux power devices and can be directly used as a gasket to meet different usage environments.
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Product Details

  • The thermal conductivity is 5-10 times that of traditional silicone oil based materials, with obvious performance advantages;

  • Stable physicochemical properties, non-toxic and harmless, not easily volatile, more suitable for long-term applications in high-temperature and high heat flux environments;

  • Long term use of non volatile organic matter and non polluting optical devices makes it the best choice among similar products in applications such as lasers, with exclusive advantages;

  • High temperature resistance, much higher than existing thermal interface materials;

  • It can also be safely used in organic solutions in immersion environments and is compatible with all coolants.

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Address:No.7 Fuyong East, Building C, Fenghuang Third Industrial Zone, Bao'an District, Shenzhen

Tel:0755-27327247

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